Micron Technology · High Bandwidth Memory (HBM) stack

Micron HBM3E 12-High 36GB

MPN: HBM3E 12-high 36GB
Family: HBM3E
Category: Memory
Condition: New

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Description

Micron HBM3E 12-high is a High Bandwidth Memory stack with 36 GB of capacity per stack. Micron specifies pin speeds greater than 9.2 Gbps and bandwidth greater than 1.2 TB/s per stack over a 1024-bit interface, and highlights lower power per bit as a key design goal for this generation.

HBM is integrated beside AI accelerators and HPC processors on 2.5D packages by the chip and package makers, so it is bought by those manufacturers rather than by system builders. Micron supplies HBM under allocation and there is no public catalog price. This item is quoted on request only; send your quantity, application and delivery country.

Key specs

Memory type: HBM3E
Stack height: 12-high
Capacity per stack: 36 GB
Pin speed: Greater than 9.2 Gbps (Micron spec)
Bandwidth per stack: Greater than 1.2 TB/s (Micron spec)

Specifications

Memory type	HBM3E
Stack height	12-high
Capacity per stack	36 GB
Pin speed	Greater than 9.2 Gbps (Micron spec)
Bandwidth per stack	Greater than 1.2 TB/s (Micron spec)
Interface	1024-bit

Specifications are summarized from manufacturer and listing information; confirm against the manufacturer datasheet before purchase.

Manufacturer datasheet / product page (opens the manufacturer's website)