Samsung · High Bandwidth Memory (HBM) stack

Samsung HBM3E 12-High 36GB (Shinebolt)

MPN: HBM3E 12H 36GB
Family: HBM3E
Category: Memory
Condition: New

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Description

Samsung's HBM3E 12H, sold under the Shinebolt name, is a 12-high High Bandwidth Memory stack with 36 GB of capacity. Samsung specifies pin speeds of up to 9.8 Gbps and up to 1,280 GB/s of bandwidth per stack over a 1024-bit interface.

HBM stacks are not board-level parts. They are placed next to a GPU or ASIC on a 2.5D package by the chip maker, so they are bought by accelerator and package manufacturers rather than by system builders. HBM is supplied under allocation and supply agreements, not through catalog distribution, and there is no public price. We take sourcing requests from qualified buyers and quote case by case.

Key specs

Memory type: HBM3E
Stack height: 12-high (12H)
Capacity per stack: 36 GB
Pin speed: Up to 9.8 Gbps (Samsung spec)
Bandwidth per stack: Up to 1,280 GB/s (Samsung spec)

Specifications

Memory type	HBM3E
Stack height	12-high (12H)
Capacity per stack	36 GB
Pin speed	Up to 9.8 Gbps (Samsung spec)
Bandwidth per stack	Up to 1,280 GB/s (Samsung spec)
Interface	1024-bit

Specifications are summarized from manufacturer and listing information; confirm against the manufacturer datasheet before purchase.

Manufacturer datasheet / product page (opens the manufacturer's website)