Samsung HBM3E 12-High 36GB (Shinebolt)
HBM3E, 12-high stack, 36 GB, up to 9.8 Gbps per pin
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SK hynix HBM3E 12-Hi is a 12-layer High Bandwidth Memory stack with 36 GB of capacity. SK hynix specifies a pin speed of 9.6 Gbps and over 1.2 TB/s of bandwidth per stack over a 1024-bit interface.
HBM stacks are integrated next to GPUs and AI ASICs on 2.5D packages by the chip and package makers, so they are not used on ordinary circuit boards. SK hynix supplies HBM directly to those manufacturers under supply agreements rather than through public price lists. This listing exists for sourcing requests: tell us your quantity, the application and the delivery country, and requests are handled case by case.
| Memory type | HBM3E |
|---|---|
| Stack height | 12-high |
| Capacity per stack | 36 GB |
| Pin speed | 9.6 Gbps (SK hynix spec) |
| Bandwidth per stack | Over 1.2 TB/s (SK hynix spec) |
| Interface | 1024-bit |
Specifications are summarized from manufacturer and listing information; confirm against the manufacturer datasheet before purchase.
Manufacturer datasheet / product page (opens the manufacturer's website)
HBM3E, 12-high stack, 36 GB, up to 9.8 Gbps per pin
HBM3E, 12-high stack, 36 GB, >9.2 Gbps per pin
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